Positive photosensitive resin, process for production thereof, and resist composition containing positive photosensitive resin
US-7521171-B2Abstract
The positive photosensitive resin of the present invention has an acid-labile protecting group and the structure represented by the following general formula (1): (wherein X 1 and X 2 may be the sake or different and each independently a straight or branched chain hydrocarbon group, having 1 to 30 carbon atoms, an alicyclic hydrocarbon group or a heterocyclic group, which may substituted with straight or branched chain hydrocarbon of 1 to 6 carbon atoms or —O— hydrocarbon; Y 1 and Y 2 may be the same or different and are each independently a hydrogen atom, a straight or branched chain hydrocarbon group having 1 to 6 carbon atoms, a sulfur-containing hydrocarbon group, or an aromatic hydrocarbon group which may have a substituent; and two Zs may be the same or different and each independently an oxygen atom or a sulfur atom).
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